Advanced Packaging
Articles (5)
Europe Formalizes Advanced Materials Strategy but Doesn't Name the Substrates Its Fabs Actually Need
The GCSA produced principles, not production targets. The Advanced Materials Act decides whether European fabs get domestic substrates.
Copper Kings Buy the Fiber Layer: Credo and Molex Lock Down Silicon Photonics in 48 Hours
Two acquisitions, two days apart, at adjacent layers of the same stack. Credo's $873M cash-and-stock deal for DustPhotonics and Molex's Teramount buy tell the market the copper-era interconnect champions have decided the AI factory's fiber layer isn't something they're willing to source.
Anthropic Locks 3.5 GW of Google TPU Capacity as Commercial AI Pre-Purchases Infrastructure Scientific Computing Will Need
Broadcom will supply Anthropic with 3.5 GW of Google TPU capacity through 2031; ~23-35x the power of DOE's largest planned science supercomputer.
Samsung Bets Vertical Integration Can Close TSMC's Silicon Photonics Lead
Samsung launched a silicon photonics foundry platform at OFC 2026, targeting 2028 PIC mass production and 2029 CPO services, pitching vertical integration of HBM, logic, packaging, and photonics against TSMC's production lead
Chiplets in 2026: from architecture slides to production silicon
The Chiplet Summit marked the transition from "chiplets as concept" to "chiplets as product." The winners won't be the ones with the best silicon. They'll be the ones with the best software and the deepest packaging ecosystem.