Semiconductor Manufacturing
Articles (15)
Advanced Packaging Is Constraining AI Accelerators - While US Funding Targets the Next Bottlenecks
TSMC says packaging capacity is limiting customer growth. The $874 million Commerce proposes funds the bottleneck after this one.
AMD EPYC 9006 Makes the CPU Case for the Agentic Data Center
Venice adds cores, memory bandwidth and I/O for the work around inference, while AMD's rack-scale claims still await independent validation.
Four Listings, One Ledger: China's GPU Buildout in Audited Numbers
China's listed GPU pure-plays now have comparable audited numbers: an industry that is real, unprofitable, customer-concentrated, and scaling anyway.
Three Bets Against Nvidia's Inference Margin, One Shared Dependency
OpenAI, Qualcomm, and Etched are betting against Nvidia's inference margin. Escaping it means queuing for the same TSMC packaging and memory. Most ASIC challengers die on software, not silicon.
America's $2 Billion Quantum Bet: Two Foundry Models, Nine Equity Stakes
Commerce signed nine LOIs worth $2.013 billion to anchor a U.S. quantum supercomputing supply chain. Two foundry models funded in parallel, federal equity in every recipient.
Thermodynamic Computing's First Silicon Is Back from the Fab. The Power Math Comes Next.
Normal Computing's CN101 is in characterization. Extropic has a prototype platform, an MIT-co-authored arXiv preprint, and an ETH Zurich hackathon in June. After two years as a manifesto, thermodynamic computing is producing the kind of artifacts readers can evaluate.
Apple's Mac Shortage Signals Memory Supply Chain Has Reorganized Around Data Center AI
Apple cut Mac memory ceilings and delayed M5 Ultra by four months as HBM production for data center AI consumes edge LPDDR5X allocation.
Europe Formalizes Advanced Materials Strategy but Doesn't Name the Substrates Its Fabs Actually Need
The GCSA produced principles, not production targets. The Advanced Materials Act decides whether European fabs get domestic substrates.
HFAC Clears 16-Bill Chip Export Package on 150-Day Allied Clock
Sixteen bills cleared, silicon-level verification on deck, and an industry that hasn't spoken.
Vera Rubin's Memory Stack Is Korean. How Three Vendors Got There Tells You Why It Will Stay That Way.
Samsung, SK hynix, and Micron converged on SOCAMM2 mass production within six weeks for NVIDIA's Vera Rubin. Korean suppliers now control both memory tiers.
NVIDIA's $4 Billion Photonics Bet Is an Admission: The AI Buildout Has a Materials Problem
NVIDIA's $4B investment in Lumentum and Coherent signals indium phosphide scarcity and power equipment lead times are gating $2.52T AI spending forecast.
IBM's Arm Partnership Bets on Dual-Architecture Enterprise AI — But the Benchmarks Aren't There Yet
IBM's Arm collaboration introduces Telum II and Spyre for enterprise AI, but lacks benchmarks, named customers, and CUDA compatibility disclosure.
Chiplets in 2026: from architecture slides to production silicon
The Chiplet Summit marked the transition from "chiplets as concept" to "chiplets as product." The winners won't be the ones with the best silicon. They'll be the ones with the best software and the deepest packaging ecosystem.
Electro-optic polymers hit the foundry: the materials battle for next-gen photonic interconnects
Lightwave Logic's deal with Tower Semiconductor puts polymer modulators into production silicon photonics. Meanwhile, III-V compounds are pushing 400G per lane. The fight to replace silicon's optical limitations is getting real.
IonQ's $100 million milestone and the vertical integration gambit
The first pure-play quantum computing company to cross $100M in annual revenue just spent $1.8 billion acquiring a semiconductor foundry. That tells you where quantum is heading.