Person

K.C. Hsu

TSMC vice president for advanced packaging technology development who opened the 2026 SEMI Silicon Photonics Global Summit.

Vice President, Advanced Packaging Technology Development, TSMC

Covered in 1 article · September 2026

Mentioned in

Sep 4, 2026

EmergingTSMC Names Lasers, Fiber, Connectors and Test as Co-Packaged Optics Scaling Constraints

Covered alongside

Architecture Vision: Open Silicon Photonics for AI Systems ASE Technology Holding AXT Ayar Labs Ayar Labs TeraPHY Broadcom